Intel Atom Z510 and Intel System controller Hub US15W CPU with 1.1GHz, 512kB L2-Cache, 400MHz FSB. 1.0GB DDR2 memory, onboard 2.0GB commercial SSD (MLC) and SATA.

Intel Atom Z510 and Intel System controller Hub US15W CPU with 1.1GHz, 512kB L2-Cache, 400MHz FSB. 1.0GB DDR2 memory and SATA. No SSD-Flash onboard.

Intel Atom Z530 and Intel System controller Hub US15W CPU with 1.6GHz, 512kB L2-Cache, 533MHz FSB. 1.0GB DDR2 memory and onboard 2.0 GB commercial (MLC) SSD. No SATA.

Intel Atom Z530 and Intel System controller Hub US15W CPU with 1.6GHz, 512kB L2-Cache, 533MHz FSB. 1.0GB DDR2 memory, onboard 4.0GB commercial SSD (MLC) and SATA.

Heatspreader for Qseven-Module conga-QA with 2.5mm threaded standoffs.

Evaluation platform for Qseven

Complete ready-to-use starter-kit for mobile applications

Cable Kit for Qseven mini carrier board. Consisting of: 4x USB adapter cable, 1x LVDS display cable, 1x Feature connector cable, 1x HDMI to DVI adapter cable.

LVDS to DVI converter board for digital flat panels with onboard EEPROM

COM Express Basic modul with Intel® Core™ i5-520M Processor with 2.4GHz (Max Turbo Frequency 2.933 GHz), 3MB L2 cache, 1066MT/s dual channel DDR3 memory interface.

DDR3-SODIMM memory module with 1 GB RAM (1066 MT/s)

Intel® Core™ I7-620LE Processor with 2.0 GHz (BGA) (Max. Turbo Frequency 2.8GHz), 4MB L2 cache, 1066MT/s dual channel DDR3 SODIMM memory interface for up to 8GB.

Intel® Core™ i3-330E Processor with 2.13GHz (BGA), 3MB L2 cache, 1066MT/s dual channel DDR3 SODIMM memory interface for up to 8GB.

DDR3-SODIMM memory module with 2 GB RAM (1066 MT/s)

COM-Express-Basic-Module with Intel GM45 and Intel Core2Duo T9400, CPU with 2.53 GHz, 6 MB L2-Cache and 1066 Mhz FSB

COM-Express-Basic-Module with Intel GL40 and Intel Celeron M 575, CPU with 2.0 Ghz, 1 MB L2-Cache and 667 MHz FSB. No PEG-Port!

Thermal Stack Set (TSS) for COM Express Basic module conga-BM45/T9400. This set includes three thermal stacks: 1x for CPU, 1x for GMCH and 1x for IOCH. Attention: These thermal stacks may only be used to adapt the COM Express module on the customer specific cooling solution. The thermal stacks only are not adequate to cool the COM Express module. Recommended for horizontal use.

DDR3-SODIMM memory module with 2 GB RAM (1066 MT/s)

COMExpress Basic modul with Intel Core 2 Duo 1.86GHz Penryn CPU SL9400, 6MB L2 cache, 1066MHz FSB.

COMExpress Basic modul with Intel Core 2 Duo 1.2GHz Penryn CPU SU9300, 3MB L2 cache, 800MHz FSB.

COM Express Basic modul with Intel® Celeron® M Processor ULV 722 with 1.2GHz, 1MB L2 cache, 800MHz FSB.

Heatspreader for conga-BS45 Standoff with M2.5mm thread

DDR3-SODIMM memory module with 2 GB RAM (1066 MT/s)

COM Express Compact modul with Intel Core2Duo 1.85GHz Penryn CPU SL9400, 6MB L2 cache and 1066MHz FSB

COM Express Compact modul with Intel Celeron M Processor 723 with 1.2GHz, 1MB L2 cache and 800MHz FSB.

Heatspreader for COM-Express-Compact-Module conga-CS45 Standoff with 2.7mm bore hole.

DDR3-SODIMM memory module with 1 GB RAM (1066 MT/s)

COM-Express-Basic-module with Intel 945GM chipset and Intel Celeron M 423, ULV-CPU with 1.06 GHz, 1 MB L2-Cache and 533 Mhz FSB

COM-Express-Basic-module with Intel 945GM chipset and Intel CoreDuo L2400, CPU with 1.66 Ghz, 2 MB L2-Cache and 667 Mhz FSB

COM-Express-Basic-module with Intel 945GM chipset and Intel Celeron M 440, CPU with 1.86 GHz, 1 MB L2-Cache and 533 Mhz FSB

512 MByte DDR2 SODIMM memory module

2 GByte DDR2 SODIMM memory module

Heatspreader for conga-B945, Standoff with M2.5mm thread

Standard active cooling solution for COM Express modules conga-B945 BGA variant, surface black with 10mm fins, integrated 12V fan 5500rpm, cable length 200mm, w/3 pin, 2.54 pitch connector, thread standoffs

Standard passive cooling solution for COM Express modules conga-B945 BGA variant, surface black with 10mm fins, thread standoffs

512 MByte DDR2 SODIMM memory module

2 GByte DDR2 SODIMM memory module

Heatspreader for conga-B945 socket, Standoff with M2.5mm thread

Standard active cooling solution for COM Express modules conga-B945 socket variant, surface black with 10mm fins, integrated 12V fan 5500rpm, cable length 200mm, w/3 pin, 2.54 pitch connector, thread standoffs

Standard passive cooling solution for COM Express modules conga-B945 socket variant, surface black with 10mm fins, thread standoffs

COM Express Basic module with Intel 945GME and Intel Atom N270 with 1.6GHz, 512kb L2-Cache and 533MHz FSB

Heatspreader for COM-Express-Basic-Module conga-BA945/N270 Standoff with 2.5mm thread

DDR2-SODIMM memory module with 512MB RAM (667 MT/s)

COM Express Compact Module (95 x 95mm) with Type II connector layout featuring Intel® Atom N270 (SC) 1.6GHz CPU, 512kB L2-Cache und 533MHz FSB, supports up to 2GB SO-DIMM DDR2 533MT/s PC2-4200 physical memory.

Standard heatspreader for COM Express Compact module conga-CA945. All stand-offs are M2.5mm threaded.

Standard passive cooling solution for COM-Express-Compact-Module conga-CA945 surface black with 10mm fins, thread standoffs

DDR2-SODIMM memory module with 1GB RAM (667 MT/s)

COM Express module with Intel 910GMLE chipset and Intel Celeron M with 600MHz, 512 kB L2-Cache and 400 Mhz FSB

COM Express module with Intel 910GMLE chipset and Intel Celeron M with 1.5GHz, 1 MByte L2-Cache and 400 Mhz FSB

Heatspreader for conga-B915, Standoff with M2.5mm thread

Standard active cooling solution for COM Express modules conga-B915 BGA variant, surface black with 10mm fins, integrated 12V fan 5500rpm, cable length 200mm, w/3 pin, 2.54 pitch connector, thread standoffs

Standard passive cooling solution for COM Express modules conga-B915 BGA variant, surface black with 10mm fins, thread standoffs

512 MByte DDR2 SODIMM memory module

COM-Express-Compact-Module with Intel Atom Z510 and Intel System controller Hub US15W, CPU with 1.1GHz, 512kB L2-Cache, 400MHz FSB and 512MB DDR2 400MT/s onboard memory

COM-Express-Compact-module with Intel Atom Z530 and Intel System controller Hub US15W, CPU with 1.1GHz, 512kB L2-Cache, 400MHz FSB and 512MB DDR2 400MT/s onboard memory. 2x PCI-Express x1 lanes, no PCI-Bus, no SATA, no GB LAN.

COM-Express-Compact-module with Intel Atom Z530 and Intel System controller Hub US15W, CPU with 1.6GHz, 512kB L2-Cache, 533MHz FSB and 1.0 GB DDR2 533MT/s onboard memory. 1x PCI-Express x1 lanes and GB LAN onboard.

COM Express compact module with Intel® Atom™ Z510 PT and Intel SCH US15WPT, CPU with 1.1 GHz, 512kb L2 Cache and 533MHz FSB. No SSD onboard. No PCIe lane.

COM-Express-Compact-module with Intel Atom Z520 PT and Intel SCH US15WPT, CPU with 1.3 GHz, 512kB L2-Cache and 533MHz FSB. 2.0GB onboard SSD and 1x PCIe lane.

COM-Express-Compact-module with AMD Geode LX800 mit 500 Mhz, LVDS graphics-interface, GB-LAN

512 MByte DDR1 SODIMM memory module

Heatspreader for conga-CLX, Standoff with 2.7mm bore hole

Evaluation carrier board for COM-Express-modules.

High Definition Audio evaluation adapter for conga-CEVAL

COM-Express-Starterkit, incl. conga-CEVAL (PN: 065749), conga-CDEBUG (PN: 047854), conga-FPA1 (PN: 024241), Dual DVI-D ADD2 card (PN: 013226), Power supply, USB-Stick, ... Without COM Express-module

Second accumulator only for the conga SBM2 Kit

SMART Battery Manager Module Design Kit for COM including licence agreement for costumer integration, Hardware design files (Schematics, Bill of Material), Battery Manager Firmware (incl. commented source code), AVR-Programming Tool AT90 JTAG ICE MKII

The conga-HDMI/DisplayPort adapter is used fo convert the chipset graphic ports Port-B, Port-C and Port-D to the HDMI or DisplayPort Interface

ADD2 display adapter card with dual independent DVI-D output. Suitable for all Intel based platforms that support Serial Digital Display Outputs (SDVO) on the standard x16 PCI Express Graphics (PEG) port.

Flatpanel prototype adapter to develop your own flatpanel adapter Including cables set.

XTX-module with Intel® GME965 chipset and Intel® Core™ 2 Duo 1.6 GHz LV, 4 MB L2-Cache, 800MHz FSB (Intel code L7500)

XTX-module with Intel® GLE960 chipset and Intel® Celeron M 2.0 GHz, 1 MB L2-Cache, 533MHz FSB (Intel code 550)

XTX-module with Intel 945GM chipset and Intel Celeron M 423, ULV-CPU with 1.06 GHz, 1 MB L2-Cache and 533 Mhz FSB

XTX-module with Intel 945GM chipset and Intel Core2Duo U7500, ULV-CPU with 1.06 GHz, 2 MB L2-Cache and 533 Mhz FSB

XTX-module with Intel 945GM chipset and Intel Core2Duo L7400, LV-CPU with 1.5 Ghz, 2 MB L2-Cache and 667 Mhz FSB

1 GByte DDR2 SODIMM memory module

Heatspreader for conga-X915 and conga-X945, Standoff with 2.7mm bore hole

Standard active cooling solution for XTX modules conga-X915/X945, surface black with 10mm fins, integrated 12V fan 5500rpm, cable length 200mm, w/3 pin, 2.54 pitch connector, bore hole standoffs

Standard passive cooling solution for XTX modules conga-X915/X945, surface black with 10mm fins, bore hole standoffs

Standard passive cooling solution for XTX-Module conga-X915 and conga-X945 surface black with 10mm vertical fins, bore hole standoffs

XTX module with Intel® Atom N270 1.6GHz CPU, 512kB L2-Cache and 533 MHz FSB.

Standard heatspreader for the XTX module conga-XA945. All stand-offs are M2.5mm threaded.

XTX-module with Intel 910GM chipset and Intel Celeron M with 600MHz, 512 kB L2-Cache and 400 Mhz FSB

XTX-module with Intel 915GM chipset and Intel Pentium M 738, LV-CPU with 1.4 GHz, 2 MB L2-Cache and 400 Mhz FSB

XTX-module with Intel 915GM chipset and Intel Pentium M 745, CPU with 1.8 GHz, 2 MB L2-Cache and 400 Mhz FSB

1 GByte DDR2 SODIMM memory module

Heatspreader for conga-X915 and conga-X945, Standoff with 2.7mm bore hole

Standard active cooling solution for XTX modules conga-X915/X945, surface black with 10mm fins, integrated 12V fan 5500rpm, cable length 200mm, w/3 pin, 2.54 pitch connector, bore hole standoffs

Standard passive cooling solution for XTX modules conga-X915/X945, surface black with 10mm fins, bore hole standoffs

Standard passive cooling solution for XTX-Module conga-X915 and conga-X945 surface black with 10mm vertical fins, bore hole standoffs

XTX-module with Intel 852GM chipset and Intel Celeron M with 600MHz, 512kB L2-Cache and 400 Mhz FSB

256 MByte DDR1 SODIMM memory module

1 GByte DDR1 SODIMM memory module

Standard active cooling solution for XTX modules conga-X855/E855, surface black with 10mm fins, integrated 12V fan 5500rpm, cable length 200mm, w/3 pin, 2.54 pitch connector, thread standoffs

Standard passive cooling solution for XTX modules conga-X855/E855, surface black with 10mm fins, thread standoffs

Heatspreader for conga-E855 and conga-X855, Standoff with M2.5mm thread

Standard passive cooling solution for XTX-Module conga-X855 and ETX-Module conga-E855, surface black with 10mm vertical fins, thread standoffs

XTX-module with AMD Geode LX800 and AMD companion chip CS5536 mit 500 Mhz, LVDS graphics-interface

256 MByte DDR1 SODIMM memory module

1 GByte DDR1 SODIMM memory module

Heatspreader for conga-XLX, Standoff with M2.5mm thread

SMART Battery Manager Module

Starterkit to evaluate SBM-Features. With SMART-Battery Manager Module and cable set.

Evaluation carrier board for XTX-modules.

Carrier board for XTX-modules. Formfactor mini-ITX, ...

Data cable for conga-LVDI LVDS to DVI adapter, dual row 2mm 34 pin 1mm pitch ribbon cable, length 15cm

Evaluation platform to convert SDVO to DVI-D

Flatpanel prototype adapter to develop your own flatpanel adapter Including cables set.

Connector for ETX and XTX carrier boards, height 9.5 mm, packing unit 8 pieces

ETX-module with Intel 852GM chipset and Intel Celeron M with 600MHz, 512kB L2-Cache and 400 Mhz FSB

ETX-module with Intel 855GME chipset and Intel Celeron M 370 CPU with 1.5 GHz, 512kb L2-Cache and 400 Mhz FSB

512 MByte DDR1 SODIMM memory module

Heatspreader for conga-E855 and conga-X855, Standoff with 2.7mm bore hole

Standard active cooling solution for XTX modules conga-X855/E855, surface black with 10mm fins, integrated 12V fan 5500rpm, cable length 200mm, w/3 pin, 2.54 pitch connector, bore hole standoffs

Standard passive cooling solution for XTX modules conga-X855/E855, surface black with 10mm fins, bore hole standoffs

Standard passive cooling solution for XTX-Module conga-X855 and ETX-Module conga-E855, surface black with 10mm vertical fins, bore hole standoffs

ETX-module with AMD Geode LX800 mit 500 Mhz, LVDS graphics-interface

256 MByte DDR1 SODIMM memory module

1 GByte DDR1 SODIMM memory module

ETX Embedded Computer Module, AMD Geode LX 800, 128 MByte DRAM onboard, LVDS

ETX Embedded Computer Module, AMD Geode LX 800, 256 MByte DRAM onboard, TTL

Evaluation carrier board for ETX-modules

Connector for ETX and XTX carrier boards, height 3.0 mm, packing unit 8 pieces