congatec, Inc.
phone 858-457-2600
fax 858-457-2602
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Maximum computing performance combined with an integrated high speed graphics controller

COM Express Type 2 module featuring 32 nm processors up Intel® Core™ i7

Extreme Performance

The conga-BM57 supports several processor variants up to the Intel® Core™ i7-620M with 2.53 GHz speed, 4 MByte shared L2 cache and 1066 MHz FSB. When utilizing the Intel® Turbo Boost Technology, a maximum frequency of 3.33 GHz is supported. The conga-BM57 features the powerful Mobile Intel® HM55 Platform Controller Hub (PCH).

Supported Processors

  • Intel® Core™ i7-620M, 2.66 GHz (32 nm process, 4M cache, 1066 MHz FSB, TDP 35 W, PGA package)
  • Intel® Core™ i5-520M, 2.4 GHz (32 nm process, 3M cache, 1066 MHz FSB, TDP 35 W, PGA package)

Integrated dual channel memory controller, up to 17.1 GByte/sec. memory bandwidth.
Integrated Intel® HD Graphics with dynamic frequency up to 667 MHz
Intel® Clear Video HD Technology

Graphics Efficiency

The on chip graphics controller supports the Intel® FDI (Intel® Flexible Display Interface). This mobile Intel® 5 Series chipset graphics features the latest 3D, 2D and streaming video capabilities. It supports Dynamic Video Memory Technology (DVMT 5.0), hardware accelerated HDTV video streaming and DirectX10. Additionally, the conga-BM57 supports automatic display recognition.

In order to help reduce power consumption, the clock speed and supply voltages are dynamically adapted to the software application demands of the graphics controller.

Graphics Outputs

Both independent graphic pipelines can use either 2x24 Bit LVDS, SDVO (for 2x DVI), TV-Out, analog VGA or the new interfaces DisplayPort and HDMI.

Gigabit Ethernet

The conga-BM57 integrates the the powerful Intel® Hansville-M 82577 Gigabit Ethernet controller.

COM Express Basic

The “Basic” version, based on the COM Express Type 2 pinout, measures only 95x125mm². All mechanical and electrical definitions are defined within the PICMG COM Express Rev. 1.0 specification.

Lead-free Design (RoHS)

All congatec AG designs are created form lead-free components and are completely RoHS compliant.

Mass Storage

Three serial SATA-2 drives can be connected as fast mass storage devices. In order to support economical and robust CompactFlash cards, parallel ATA is also available.

Connectivity

Thanks to the 8x USB 2.0, 3x SATA®, 5x PCI Express Lanes, SDVO, PCI, I²C,... the conga-BM57 offers more connectivity than most other computer modules.

Audio

conga-BM57 can utilize several high definition audio (HDA) codecs. This allows for the easy implementation of telephone and audio applications that require the highest sound quality and numerous channels.

Security

The conga-BM57 is equipped with a discret, onboard "Trusted Platform Module" (TPM). It is capable to calulate efficient hash and RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications, such as gaming and ecommerce, will benefit also with improved authentification, integrity and confidence levels.

Software and Driver Support

congatec offers advanced Board-Support-Packages for the conga-BM57, which include both the latest tested drivers from silicon vendors and the congatec specific drivers for accessing all of our additional embedded BIOS features. This will help our customers reduce their time-to-market.

Embedded BIOS Features

The conga-BM57 is equipped with the congatec Embedded BIOS and supports the following features:

  • ACPI 3.0 Power Management
  • ACPI Battery Support
  • Supports Customer Specific CMOS Defaults
  • Multistage Watchdog
  • User Data Storage
  • Manufacturing Data and Board Information
  • OEM Splash Screen
  • Flat Panel Auto Detection
  • BIOS Setup Data Backup
  • Fast Mode I²C Bus
  • Real Headless Operation

Design-In Support

congatec support begins with your product idea and philosophy and continues throughout the series phase all the way up to the next product generation. This support commitment helps our customers keep system development costs low and speeds up time-to-market.

System Integration

An important factor for each system integration is the thermal design. The heatspreader is a thermal coupling interface that makes fanless and rugged solutions possible.